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3M™ DIAMOND LAPPING FILM 662XW TYPE H, 3.0 MICRON DISC, 5 IN X NH DIE# 500X, 25/INNER, 250/CASE, TELCOM

3MA7010365190 MFG #: 7010365190
$8.28 / EA
5XNH PINK 662XW
  • Abrasive Material: Diamond
  • Backing Material: Polyester
  • Backing Weight: 3 mil
  • Disc Diameter: 5 in
  • Grade: 3 micron
  • Series: 662XW
  • Type: Type H Plain Back
3M™ diamond lapping film 662XW has a higher diamond concentration and a stronger resin bond to give this product added durability and increased cut rate over our standard diamond lapping film. Available in 0.5, 1, 1.5, 3, 6 and 9 micron grades.
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  • Application
  • Item Features
Fiber Optic Connector Processing, Flat Lapping and Roll Superfinishing
  • A higher diamond concentration and a stronger resin bond give this product added durability and increased cut rate over our standard diamond lapping film
  • Increased throughput
  • Flat surface, no rounding
  • Good finish
  • Long abrasive life minimizes disc changes