3M™ DIAMOND LAPPING FILM 662XW TYPE H, 1.0 MICRON DISC, 5 IN X NH DIE# 500X, 25/INNER, 250/CASE, TELCOM
3MA7010309474
MFG #: 7010309474
$8.28
/ EA
- Abrasive Material: Diamond
- Backing Material: Polyester
- Backing Weight: 3 mil
- Disc Diameter: 5 in
- Grade: 1 micron
- Series: 662XW
- Type: Type H Plain Back
3M™ diamond lapping film 662XW has a higher diamond concentration and a stronger resin bond to give this product added durability and increased cut rate over our standard diamond lapping film. Available in 0.5, 1, 1.5, 3, 6 and 9 micron grades.
- Application
- Item Features
Fiber Optic Connector Processing, Flat Lapping and Roll Superfinishing
- A higher diamond concentration and a stronger resin bond give this product added durability and increased cut rate over our standard diamond lapping film
- Increased throughput
- Flat surface, no rounding
- Good finish
- Long abrasive life minimizes disc changes